Job Title:                                 Senior Microelectronic Packaging and Module Design Engineer

Status:                                     Full time

Location:                                 Kanata, ON

Purpose: The Mechanical and Microelectronic Packaging Design group, as part of Global Design Engineering, represents one of the key elements of total engineering service offering, by providing services in areas of microelectronic and optical device packaging, multi-chip modules design, system packaging, mechanical and thermal design. We are looking for an experienced microelectronic packaging design engineer, to work within, and to coordinate activities in an end to end product development team to successfully develop and implement advanced micro/optoelectronic packages, multi-chip modules and systems. The position involves leading/supporting projects from concept definition, detailed design, prototyping and qualification phases, through to implementation into manufacturing.

Responsibilities Generally Include:

• Define project plans, manage project activities to meet end deliverables. Coordinate activities of multidisciplinary development team with electrical/RF engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, to design modules and microelectronic packaging solutions to customer’s specifications
• Define design concepts and select key microelectronic technologies in-line with requirements
• Design microelectronic packages & modules, integrating elements of mechanical, thermal, reliability, microelectronic packaging/module integration, manufacturing, test and electrical
• Perform engineering analyses including: Thermal (conductive and convective types), mechanical stress due to CTE mismatch and statistical tolerance
• Generate product documentation including design specifications, custom part drawings, assembly drawings, engineering Bill of Materials, common feature drawings and process flows
• Define specifications/requirements for outsourced custom components and coordinate/interface with manufacturers/suppliers
• Perform engineering product verification to ensure compliance to requirements
• Support new business development by interfacing with new customers, defining proposals and quotations
• Support product implementation into manufacturing

Skills/Qualifications/Education:

• Relevant engineering degree with multi-year relevant experience
• Experience in design of RF/Microwave/Optical multi-chip modules and packages
• Expertise in microelectronic technologies, materials, components, manufacturing methods
• Experience in end to end product development and manufacturing implementation
• Experience with latest design and modeling techniques and CAD tools
• Strong project management skills
• Security clearance is an asset
• Need to be customer delivery focused, with strong communication skills, able to work well within multidisciplinary product development team, in a fast paced challenging environment

If you are interested in joining our dynamic team, please submit your resume to Human Resources at resumes@breconridge.com and reference the position title in the subject line of your email.