High Speed Semiconductor Packaging & Multi-Chip Module Design

Experienced in bare-die packaging technologies and high speed/RF components and modules design, BreconRidge offers the following services for high speed microelectronics and optical packaging and modules design:

• Semiconductor packaging:
  • Packaging of bare die semiconductor devices
  • Substrate technology selection and design
  • Die level interconnection (wirebonding, flip chip)
  • Thermal design
  • Die level protection design (hermetic, non-hermetic)
  • 2nd level interconnection
  • Reliability
  • EMI containment

• MultiChip Module Design
  • System level design
  • Integration of multiple active and passive devices
  • System fit and interconnection
  • Materials and substrate technologies
  • Electrical and optical interconnection
  • Thermal management
  • EMC/EMI technologies
  • Optimization for yield control and reworkability
  • Design for cost effective volume manufacturing and testing
  • Design for volume manufacturing
    
    
• Assembly and test strategy definition
• Prototyping and Design Verification

These services draw from extensive expertise in semiconductor packaging technology. 

• Multiple footprint solutions (BGA, LGA, LCC, QFN, etc. )
• Multiple applications (Multi-technology ASIC 's, RF analog/digital devices, with Flip Chip or Chip & Wire interconnections, optical devices)
• Multiple substrate technology solutions (HTCC, LTCC, High speed organic, Flex, Hybrid, etc.)
• Multiple die level technology options (Si, SiGe, GaAs, InP, etc.)
• Multiple module level interconnection solutions (BGA, RF connectors, Flex connectors, Optical connectors, etc.)