Structural Test Capabilities

Automated X-ray  Inspection (AXI)
A key component of a structural test strategy is automated x-ray inspection (AXI). Using 3D laminography technology, AXI provides clear images of single layers (or slices) of a printed circuit board. Compared to 2D technology, 3D offers superior capability for inspecting solder joints that are overlapping in double-sided boards.  AXI generates images of solder joints that can be analyzed automatically to detect structural defects such as solder integrity (insufficient, excess, cold solder), placement defects (bent/lifted leads, missing/misaligned components), marginal joints, voiding, shorts, opens and tombstones.  AXI also possesses unique capabilities in isolating hidden defects such as solder ball inconsistencies in BGAs and other array-style packages, heels of solder joints on fine pitch packages, or components under RF shields.

Automated Optical Inspection (AOI)
BreconRidge utilizes AOI at various locations in the SMT board assembly process to characterize specific processes such as post-paste deposition, post-placement, post-solder reflow or wave. AOI is an excellent tool to characterize the placement process.
Critical measurements include component XY offset relative to fiducials and skew of placement. AOI complements AXI by checking components polarity and orientation, damaged/inverted components and parts markings/sizes.

In-Circuit Test (ICT)
Using a “bed-of-nails” test fixture to access test points on a board, ICT is an rapid and effective technique to localize structural defects and isolate electrical faults.

Complementing AXI and AOI, ICT is capable of providing five basic tests:

1. Connectivity tests (shorts and opens),
2. Analog tests (component values and critical tolerances),
3. Hybrid tests (combination of analog and digital components),
4. Digital tests (operation of digital devices) 
5. Boundary Scan-based component tests.

ICT offers on-board programming of components, and can also be used to perform special functional tests and self tests.

Flying Probe
Similar to ICT, but using a fixtureless approach, Flying Probe provides a cost-effective structural test solution for prototypes and low volume production.

Flying Probe is particularly useful when full test access is limited due to space constraints, performance considerations, or when DFT requirements are not implemented.

Flying Probe combines the AOI and ICT benefits, and offers unpowered and powered tests including vectorless open pin tests, on-board programming of components and Boundary Scan tests.

ASSET/JTAG
Leveraging the advantages of Boundary Scan for testing boards with limited access, the ASSET/JTAG system provides a PC-based, cost-effective solution, which can be applied for all phases of the product life cycle.

ASSET/JTAG provides capabilities for interconnect testing on devices, boards and systems; cluster tests for non-Boundary Scan devices surrounded by Boundary Scan-compliant devices; access to BIST within devices in a system; and ISP programming of logic and flash memory devices.

ScanPro+
ScanPro+ is a proprietary (patent-pending) technique developed by BreconRidge, for testing Boundary Scan-compliant circuitry using a reduced version of ICT fixture; thereby minimizing fixture complexity and cost.

The ScanPro+ approach can be implemented for prototype testing, and can be scaled to accommodate board design changes; leading to the reuse of  ICT fixtures for volume production.