Supply Chain Management

An integral component of BreconRidge’s value proposition is the design and management of a comprehensive supply chain. Utilizing an established supply chain in North America, Europe and Asia, BreconRidge is able to leverage economies of scale in order to provide the most cost effective supply chain solution to customers of all sizes.

BreconRidge offers supply chain expertise from locations in North America, Hong Kong, and Shenzhen China in support of manufacturing operations in Canada, the United States and Shenzhen.

Microelectronic Assembly
BreconRidge offers state of the art microelectronic manufacturing assembly services for RF/microwave and Optical applications, including:

• Chip & wire assembly processes based on automated cells
• Flip chip & BGA attach processes based on automated solder screen printing, automated placement and multi stage convection reflow oven processes

Assembly Processing Expertise includes:

• Die attach: eutectic and epoxy attach
• Flip Chip and underfill: reflow and underfill of F/C devices down to 4 mils bump 
• Wirebonding: fully automated and manual capabilities for ball, wedge and ribbon bonding, including deep access capability.
• Epoxy dispense: automated dispensing for component attach as well as structural interconnect of complex structure
• Solder dispensing: High frequency RF connector pin soldering interconnection and solder interconnection in recessed areas
• Automated high precision component placement and interconnect
• Ball Grid Array: ball attach, reflow and rework
• Component integration based on epoxy, solder and laser welding processes
• Hermetic sealing and leak testing: hermetic lid attach (seam sealing / welding / epoxy), helium leak testing, helium bomb testing
• Laser branding
• Plasma cleaning (Argon and Oxygen)
• Module integration with specialized sub-components

BreconRidge’s microelectronics infrastructure includes:

• Fully automated ultra precision assembly equipment
• Flexible clean room, Class 1 ESD manufacturing labs based on "semi-standard" (class 1,000/10,000)

BreconRidge’s microelectronics processes are applicable to photonics / optical assembly processes and can be combined for optical product solutions in opto-electronics applications.

Optical Assembly & Integrated Manufacturing
BreconRidge offers a full array of optical manufacturing services within a class 1000 clean room environment.

Optical Assembly & Integrated manufacturing technologies include:

• Optical fiber fusion splicing, fiber handling and fiber routing.
• Precision component placement and attachment
• Optical component active and passive alignment.
• Hermetic sealing and leak testing.
• Versatile high accuracy wirebonding.
• Optical connector cleaning and inspection.

End-to-end manufacturing process for CCA-based optical modules, consisting of:

• CCA build.
• CCA structural test.
• CCA functional test.
• Optical component and CCA integration (fusion splicing).
• Final optical test/characterization for assembled photonics modules.

PCB Assembly
BreconRidge offers both Surface Mount Technology (SMT) and "through hole" circuit card assembly capabilities, through the use of high capacity, automated assembly and test equipment, including:

•  Reflow Ovens:
  • Electrovert ATMOS, Omniflo, and Vitronics convection ovens.
    
    
• Process Control/Support Equipment:
  • 8100 SMT Laser Inspection System
  • ECD Super M.O.L.E. Thermal profiling system
  • Cyber Clean 2000 Stencil Cleaner
  • Cyberoptics Laser Section Microscope (LSM)
  • Instron 4411, Pull force Tester
  • AlphaMetals Lonograph 500M SMDII,
  • Ionic Residue Tester Multicore MUST System II,
  • Wetting Balance Solderability Tester.
    
    
• In-Circuit Test:
  
  • Agilent 3070 Series and Teradyne Spectrum.

SMT
The SMT process is supported with fully automatic, vision screen printers; with multifunctional high-speed placement machines and high throughput convection reflow ovens.

Process capabilities include:

• Screen print vision systems that ensure accurate stencil alignment and consistent solder deposition.
• SMD Placement machines that provide full vision capabilities to ensure precision placements.
• Feeder setups validated using barcode technology.
• SMT lines configured for quick-change overs to maximize performance.
• Intrusive printing, pick and place and reflow
• Closed looped reflow ovens, with cooling chambers that support the creation of reliable and repeatable solder joints.

Component capabilities include:

• 0402 (0.040 x 0.020") surface mount device (SMD) chips
• 12 mil quad flat pack (QFP's)
• 0.75mm micro ball grid arrays/chip scale packages (uBGA's/CSP)
• Column grid arrays (CGA's)
• Odd form components
• Complex technologies, including Mictor connectors

Pick and Place:

• Panasonic MVIIF, MVIIC, and Siemens SP15, SP20 multifunctional chip shooters.
• Panasonic MPA-V, MPAV2, and Siemens F4 flexible machines.

Wave:

• The wave process is supported by computer controlled wave solder machines with bottom side SMD capability. Spray fluxers are used to accurately control the application of flux. Selective soldering is used for complex mix technology designs.

Wave Solder:

• Electrovert Econopak II SMT, Ultrapak 600C/650

Pressfit:

• BreconRidge pressfit capabilities include custom tool design, fabrication that supports an efficient production process.

Complex SMT Rework/Repair:

• AirVac DRS22 Convection Reflow machine, with contactless site prep, split prism alignment and Mictor capability.

Screen Printers:

• MPM 3000 Ultraflex DEK 265

Mechanical Assembly
BreconRidge provides high volume mechanical assembly within all geographic locations.  

Capabilities include:

• Automated assembly of high volume enclosures consisting of various plastics, steel and die castings.
• Use of pneumatic rivet and electric drivers with torque control
• Serial number barcode tracking to support warranty tracking and logistics management