Communications

Product Experience
BreconRidge customers benefit from our extensive communications experience established through the development and manufacture of a wide array of product types.  Some examples of communications products designed and manufactured by BreconRidge include:

• Microwave and RF Transmit/Receive Modules
• 10 Gb/s to 40 Gb/s High Speed RX/TX Modules
• IP Phone Sets/ Consoles
• IP Controllers
• Video Optical Modules
• Optical Networking Line Cards
• Optical Amplifier Modules
• Optical Transceivers and Transponders
• Fibre to the Home (FTTH) Optical Network Terminals (ONT)
• Wireless Ethernet Systems
• Wi-Fi/Wi-Max Modules, Nodes and Routers
• Analog and Digital ASIC packaging
• Network Multi-Service Aggregation Systems

Engineering Expertise
BreconRidge offers engineering expertise to solve the specific technical challenges of our communications customers to ensure leading edge, competitive products.  Some examples include:

• Design and technology expertise in line with both low cost, high volume, as well as high performance solutions specializing in high frequency/high speed product applications at component, module and system level
• Expertise in design and manufacturing of highly integrated multi-chip modules for RF and optical communications applications
• Functional and system test solutions for high speed, fibre optic based telecommunications products
• Environmental test screening/burn-in for telecommunications systems encompassing temperature and humidity cycling
• Reliability engineering and product verification testing

Unique Manufacturing Competencies

• Optical and electronic assembly at facilities in China and North America
• NPI prototyping capability in North America
• High volume, automated, micro-electronic manufacturing processes including: die attach, flip chip, chip on board, automated wire bond, hermetic sealing, and laser marking in a class 1000 clean room environment.
• Packaging of GaAs (Gallium Arsenide), Silicon (Si) Indium Phosphide (InP) and Silicon Germanium (SiGe) dies on various substrates (HTCC/LTCC, Thin Film, PCB etc.)
• High volume, automated assembly in several geographies